The Qualcomm® Robotics RB5 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.
At the heart of the kit is the Qualcomm® QRB5165 processor, customized for robotics applications, which offers powerful heterogenous computing architecture that delivers 15 Tera Operations Per Second (TOPS) of compute. The processor also offers incredible machine learning (ML) accuracy, a powerful image signal processor (ISP) with support for seven concurrent cameras, a dedicated computer vision engine for enhanced video analytics (EVA), as well as the new Qualcomm® Hexagon™ Tensor Accelerator (HTA). Its fifth-generation Qualcomm® AI Engine powers inferencing and accuracy with the dedicated Hexagon Tensor Accelerator. QRB5165 can support an industrial temperature range of –30C to +105C, with long life support. The kit can also offer LTE/5G/CBRS communications via a mezzanine card.
The QRB5165 processor and Qualcomm Robotics RB5 platform cater to wide range of applications such as autonomous mobile robots (AMR), inventory robots, retail robots, cobots, pick-sort-place robots, cleaning robots, first mile robots, last mile delivery robots and delivery drones, prosumer and commercial drones, industrial & manufacturing robots, healthcare robots, defense robots, etc.
For robotics designers who need heterogeneous computing and LTE/5G with low power consumption, the Qualcomm Robotics RB5 development kit offers a base for proofs of concept and rapid prototyping. The kit is made to streamline development and shorten time to commercialization.
There are two options to purchase the Qualcomm® Robotics RB5 Development Kit. The Core Kit includes just the mainboard and the QRB5165 SoM, whereas the Vision Kit includes the Vision Mezzanine and Camera Modules.
Note: Intel® RealSense™ Depth Camera D435i is not included. It can be purchased separately. ***
|CPU||4+4 Qualcomm® Kryo™ 585 - Gold Core @ 2.84 GHz (Octa-core 64-bit ARM v8 compliant applications processor. )|
|GPU||Qualcomm® Adreno™ 650 Native 8-bit integer support for efficient GPU DNN |
OpenGL ES 3.2, Vulkan 1.1, DX12 FL 12_1;
OpenCL 2.0 full profile
|DSP||Compute DSP : Hexagon™ DSP with Quad Hexagon™ Vector eXtensions (HVX) V66Q, 1.5 GHz, for machine learning, integrated DNN for advanced VA and Neural Processing SDK |
NPU : Qualcomm Neural Processing Unit (NPU230) for high-performance machine learning use cases
Sensor DSP : Qualcomm® Sensing Hub for contextual awareness and always-on sensor support
|RAM||8 GB LPDDR5 2750 MHz POP|
|Storage||Toshiba THGJFCT0T44BAIL (1 Tb NAND FLASH) and1 x MicroSD card slot|
|Ethernet Port||1x GbE Ethernet|
2.4 GHz/5 GHz 2x2 MIMO, 802.11a/b/g/n/ac/ax
|USB||1 x USB 2.0 Micro B (Debug only ), |
1 x USB 3.0 Type C (OTGmode),
2x USB 3.0 Type A (Host mode only)
|Display||Two 4-lane DSI D-PHY 1.2 or two 3-trio C-PHY v1.1 with VESA DSC v1.1. DisplayPort v1.4 at 8.1 Gbps/lane over Type-C with support for MST and VESA DSC v1.1 and FEC (USB3 and USB2 concurrency supported). Miracast – up to 4K60|
|Video||Video decode up to 4K240/8K60. Native decode support for H.265 Main 10, H.265 Main, H.264 High, VP9 profile 2, VP8, and MPEG-2 codecs |
Video encode up to 4K120/8K30. Native encode support for H.265 Main 10, H.265 Main, H.264 High, and VP8 codecs
|Audio||Integrated WCD9380 high fidelity audio codec. |
SoundWire interface (two Tx and two Rx data lines; optional configuration of three Tx and one Rx data lines) for codec. Dedicated SoundWire interface for smart speaker amplifier.
Essential and advance voice communications package, Voice UI activation package, Voice UI speech enhancement package, 3D audio capture package
Audio DSP V66, integrated low power island, 2 MB L2, 1.5 GHz
|Camera||64 MP 30 fps ZSL with a dual ISP. Real-time sensor input resolution: 25 + 25 + 2 + 2 + 2 + 2 + 2 with support for up to 12 cameras by D-PHY and 18 cameras by C-PHY (seven concurrent)|
|Sensors||Accelerometer + Gyro Sensor/ Proximity sensor|
|Expansion Interface||HS1:1 x 60 pin High-Speed connector (4L-MIPI DSI, USB 2.0 x2,I2C x2, 2L+4L-MIPI CSI) |
HS2:1x 60 pin High-Speed connector (4L-MIPI CSI x 2, SSC SPI, PCIe 3.0,USB 3.0 x1, GPIO x 9)
LS1:1x 96boards 40 pin Low-Speed connector (UART x2, SPI, I2S, I2C x2, GPIO x12, DC power)
LS2:1x 96boards 40 pin Low-Speed connector(headset, stereospeaker, DMIC I/F x3, CAN, I2S, GPIO x 7, PWM x 2, ADC x 2)
LS3:1x 96boards 20 pin Low-Speed connector (SSC SPI x 3, SSC I2C, sensor interrupt x 5)
|LED||7 LED indicators: |
4 - user controllable
2 - for radios (BT and WLAN activity)
1 - power indicator
|Button||Power ,Volume Up/Down,Force Usb Boot, DipSwitch(6 PIN)|
|Power Source||12V@2.5A adapter with a DC plug: |
Plug specification is inner diameter 1.75mm and outer diameter 4.75mm
|OS Support||Thundersoft LU, Linaro Linux builds with OpenEmbedded / Yocto Project|
|Size||85mm by 54 mm meeting 96Boards™ Consumer Edition Standard form dimensions specifications|